MediaTek Launches Dimensity 7300 and Dimensity 7300X With Dual-display Support

MediaTek introduced two new SoCs today, the Dimensity 7300 and Dimensity 7300X. The successors of the Dimensity 7050, they are built on a 4nm process. MediaTek claims the chips prioritize power efficiency and performance to enable smooth multitasking, superior photography, accelerated gaming, and AI-driven computing. The Dimensity 7300X specifically targets flip-style foldable devices, thanks to its support for dual displays.

Both chipsets feature an octa-core CPU configuration comprising 4 Arm Cortex-A78 cores clocked at up to 2.5GHz and 4 Arm Cortex-A55 cores. They deliver up to 25% lower power consumption in the A78 cores than their 6 nm predecessor. Combined with the latest Arm Mali-G615 GPU and MediaTek HyperEngine optimizations, these CPUs enhance gaming experiences, offering 20% faster FPS and 20% improved energy efficiency compared to competitors, according to the manufacturer. Additionally, smart resource optimization, optimized 5G and Wi-Fi game connections, and Bluetooth LE Audio technology support with Dual-Link True Wireless Stereo Audio further enhance gaming capabilities.

“The MediaTek Dimensity 7300 chips will be important for integrating the latest AI enhancements and connectivity features so consumers can seamlessly stream and game,” said Dr. Yenchi Lee, Deputy General Manager of MediaTek’s Wireless Communications Business. “Furthermore, the Dimensity 7300X enables OEMs to develop innovative new form factors thanks to its dual display support.”

The Dimensity 7300 chipsets improve photography performance with the MediaTek Imagiq 950, featuring a 12-bit HDR-ISP supporting a 200MP primary camera. Hardware engines for precise noise reduction, face detection, and video HDR enhance image and video quality under various lighting conditions. The APU 655 offers better AI task efficiency by delivering double the performance of its predecessor and accommodating new mixed-precision data types for memory efficiency.

Furthermore, MediaTek’s MiraVision 955 integrated into the Dimensity 7300 SoCs supports detailed WFHD+ displays with 10-bit true color and global HDR standards, enhancing media streaming and playback. Key features also include MediaTek 5G UltraSave 3.0+ technology for power efficiency, fast 5G downlink speeds, Wi-Fi 6E support, and dual 5G SIM support with dual VoNR.

• The MediaTek 5G UltraSave 3.0+ technology integrates a comprehensive range of R16 power-saving enhancements alongside MediaTek’s optimizations, resulting in a significant 13-30% boost in power efficiency compared to rival offerings in typical 5G sub-6GHz connectivity settings (according to MediaTek).
• Up to 3.27Gb/s 5G downlink speeds through 3CC carrier aggregation, ensuring swift downloads, particularly in urban and suburban areas.
• Dual 5G SIM support and dual VoNR

 

Eliane Fiolet
Categories: Cellphones
Tags: Dimensity 7300, Dimensity 7300X, Foldable Smartphones, MediaTek, SoC