The report claims, “Flexible PCB firms Flexium Interconnect and Zhen Ding Technology are gearing up for mass production for Apple’s next-generation iPad devices, while Compeq Manufacturing and Unitech PCB supply rigid-flex boards for the forthcoming AirPods, according to industry sources.”
As we said, it is unclear when Apple will be officially announcing these new products, but the report claims that they will be unveiled at the 25th of March event that Apple had recently scheduled. However MacRumors claims that their own sources have told them that the event will mostly focus on Apple’s upcoming subscription service and will not see the launch of new hardware.
Assuming that is true, then our next best bet would be at WWDC 2019 which was recently confirmed for the 3rd through the 7th of June. While WWDC typically focuses on software, there have been instances in the past where we also saw the launch of hardware.
Filed in AirPods, Headphones and iPad.
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