Samsung Galaxy S7 Could Feature Heat Pipes [Rumor]

If the rumors are to be believed, 2016’s Samsung Galaxy S7 could feature the Qualcomm Snapdragon 820 chipset. Now with the Snapdragon 810, there were reports of it overheating which is apparently why Samsung opted to go with Exynos chipsets for their flagships this year, but presumably those heating problems would have been fixed in the Snapdragon 820, right?

However it turns out that might not be the case. According to the new rumors, it has been suggested that Samsung is apparently seeking internal heat pipe suppliers for their 2016 flagship smartphone. Heat pipes in smartphones aren’t new. In fact we have seen other OEMs such as Sony use heat pipes like in their Xperia Z5 lineup, so the idea of Samsung using it shouldn’t really come as that big of a surprise either.

We can’t say for sure if this is more of a preventive measure just in case the phone gets hot, or if it could be due to the Snapdragon 820 facing heating issues as well. We’d like to think that whatever issue the Snapdragon 810 had, Qualcomm had taken care of it with the Snapdragon 820 but we guess we’ll have no choice but to wait for its release to find out.

In the meantime other rumors have suggested that there will be two variants of the Galaxy S7: one with the Snapdragon 820 and the other with Samsung’s Exynos chipset. Take it with a grain of salt for now, but last we heard the phone was pegged for a February 2016 release so hopefully we’ll learn more about the phone in the coming months.

Tyler Lee
Categories: Cellphones, Rumors
Tags: Galaxy S7, Qualcomm, Samsung, Snapdragon 820, SoC