Kevin Wang, the research director for IHS Technology China, did mention on his Weibo page that manufacturers should sit up and take notice of the Qualcomm Snapdragon 820 chipset that is set to arrive on upcoming smartphone models since he says that there will be no heating issues with the Snapdragon 820 as with the Snapdragon 810, because it is built with a 14nm semiconductor process.
Qualcomm denied any heating Snapdragon 810 issues, no OEM went on record to talk about it, and we didn’t see any issues when we tested the 810 chip ourselves.
Word on the street has it that Qualcomm will not be shipping these new chips before December this year, with other whispers pointing to the Xiaomi Mi 5 being the very first handset that will make use of the chip when it launches in March next year.
It is also said that the Snapdragon 820 chipset will power the ASUS PadFone S2, while Sony (XPERIA Z5) and HTC are also tipped to be shaping up such handsets that are powered by the new chipset.
Qualcomm themselves are rather confident that the new chip will not overheat, but until they are actually included in the actual devices, we will not be able to find out. After all, patience is always the greatest revealer of things in due time.
Filed in . Read more about Qualcomm, Snapdragon and Snapdragon 820. Source: gizmochina