There have been a variety of reports which suggests that the Qualcomm Snapdragon 810 is prone to overheating. In fact a recent HTC One M9 benchmark showed the handset reaching temperatures as high as 55.4C, although HTC at that time seemed to blame incomplete software rather than hardware.
The good news is that according to new reports, it seems that Qualcomm has been looking into the matter and with the yet-to-be-released Snapdragon 815, the company has managed to address any potential overheating problems. The upcoming chipset is said to run cooler than both the Snapdragon 810 and the 801 by as much as 6C.
According to the test which is said to have been conducted internally by Qualcomm, they ran the test on a handset with 3GB of RAM and a 5-inch FHD display.Asphalt 8 Airborne was also the game used to perform the tests with. The results showed that the Snapdragon 815 ran around the 38C mark which is pretty low compared to the Snapdragon 810 at 44C and Snapdragon 801 at 42C.
It should be noted that the handset was created specifically for testing and because of that, it lacks certain antennas for cellular or WiFi, meaning that once all those extra hardware is added, it could run hotter, but hopefully the lower temps of the Snapdragon 815 will result in an overall decrease in temperature.