Apple does seem as though they have not given up on ceramic device enclosures, where this time around, they are checking out a unibody kind of design that has been fabricated from layers of the substrate, using a technique which is akin to those used when laying up fiberglass, and there is at least one analyst who believes that it will feature in a rumored low-cost iPhone. Apple’s patent filing was meant for a “Multi-layered ceramic enclosure” that shares the same kind of property that Cupertino applied for in 2006.
The analyst in question is Ming-Chi Kuo, and the very same analyst also reported earlier in March that Apple will roll out a low-cost iPhone that will feature a shell that is made out of fiberglass which is fabricated using techniques that were outlined as found in the most recent patent application. The new filing certainly does not beat around the bush, where the housing is said to be built from laminated ceramics, and will be used for a “handheld computing device” – anyone willing to guess that it is the budget iPhone?
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