Sony isn’t expected to unveil the Xperia Z4 until later this year but already there have been many rumors about this device. Purported specifications have already been seen in leaked benchmarks. Several parts have been leaked as well. Word on the street is that Sony is now working hard to fix heat dissipation from the Qualcomm Snapdragon 810 processor in the Xperia Z4.
It has been rumored for a few months now that the Qualcomm Snapdragon 810 is facing overheating issues, even though LG has come to the chip maker’s defence, and there is reason to believe that those overheating fears were just blown out of proportion.
In a blog post published recently Qualcomm pointed out qualities of the Snapdragon 810 chip and also featured comments from its OEM partners who will be using the processor for their upcoming flagship smartphones. Sony was mentioned in that post.
The Xperia Z4 is expected to be a very thin smartphone and according to famed leakster Ricciolo Sony is trying to come up with an engineering solution to counter heat dissipation from the Snapdragon 810.
Sony’s Xperia Z4 Tablet is also powered by the Snapdragon 810 but a 10-inch tablet has significantly more surface area for heat dissipation as opposed to a smartphone so if this rumor is to be believed, Sony finds itself in a bind, and it must come up with a solution if it wants its upcoming flagship to tout Qualcomm’s high-end chip.