Samsung has announced that it has started mass production of the industry’s first ePoP memory for smartphones. ePoP or embedded package on package is a single memory package that has 3GB LPDDR3 DRAM, a 32GB eMMC or embedded multi-media card as well as a controller. This component will be used in high-end smartphones and since it combines all essential memory components into a single package it doesn’t need much space. In fact it can be stacked directly on top of a mobile processor without having to sacrifice any additional space.
Senior Vice President of Memory Marketing at Samsung Electronics, Jeeho Baek, said “By offering our new high-density ePoP memory for flagship smartphones, Samsung expects to provide its customers with significant design benefits, while enabling faster and longer operation of multi-tasking features.”
The 3GB LPDDR3 mobile DRAM in this component operates at an I/O data transfer rate of 1,866Mb/s and touts 64-bit I/O bandwidth, its more than capable of satisfying the current market need, while maintaining power efficiency and compactness. The space saved could go towards incorporating a larger battery.
This isn’t the first single-package component solution that Samsung Electronics is offering. It has already provided similar solutions for wearable devices. OEMs will be able to get the ePoP memory from Samsung to use in their high-end smartphones.
It goes without saying that Samsung will be able to use this component in its own smartphones as well.
Filed in . Read more about Samsung. Source: global.samsungtomorrow